New Nanotech Material Splitting Technology

Fonon Technology International has developed a completely new industrial method known to the world as Zero Width Laser Cutting Technology (ZWLCT).

The ZWLCT technique uses a laser controlled Power Density profile on the material surface to generate the subsurface forces greater than intermolecular connections. The methodology utilizes a non-contact laser induced internal stress to produce a controlled separation. Since the technique is non-contact, the surface degradation associated with mechanical scribe and break is eliminated. Yield loss as a result of particulate damage is also reduced. Cutting substrates in clean room conditions becomes feasible with ZWLCT leading to the ability to introduce a production line concept into clean room substrate manufacturing. This has not been possible before because of debris generated during cutting and edge grinding which are not generated during the ZWLCT process.

Bill Kuypers, VP Sales & Marketing for Fonon Technologies, said, "Zero Width Laser Cutting Technology is the only technology available in the world with a non dimensional cutting line. The waste material by the cutting process is totally eliminated. With this new method we can create internal tensile forces so great that we can achieve total separation of display type glass without cooling."

Fonon is located outside of Orlando, FL, and is a leading developer and manufacturer of standard marking, engraving and cutting CO₂ and Fiber Laser Solutions.

For more information contact:

Bill Kuypers, VP Sales & Marketing

Fonon Technologies

400 Rinehart Rd., Ste. 1000

Lake Mary, FL 32746

407-804-1000

bkuypers@fonon.us

www.fonon.co