Ceramic and Quartz Grinding Machine Targets Semiconductor Production
August 1, 2026
At IMTS 2026, DN Solutions will be featuring the DNC 8060: a high-performance grinding machine designed to grind silicon carbide (SiC), ceramic, and quartz materials used in semiconductor wafer production. The DNC series seamlessly integrates grinding and machining functionalities into a single, high-performance platform.
In addition to precision grinding, the DNC series provides the capability to perform complex hole machining and contouring, eliminating the need for a separate machining center and streamlining the production workflow. The DNC 8060 accommodates a diverse range of workholding options, with chuck sizes spanning from 12" to 20". For specialized applications, the DNC series can be configured with vacuum chucks to suit specific production needs.
At the heart of the DNC series is a premium grinding spindle, designed and manufactured in-house by DN Solutions. Utilizing a FANUC motor base, this spindle offers a maximum speed of 10,000 RPM and 7.5 kW of power, offering stable performance across demanding applications. Through spindle coolant (TSC) is available as an option.
The DNC series is built upon a rigid machine structure featuring a full-cover design that protects internal components from debris and enables long-term reliability. User-centric features include an easily accessible coolant tank for simplified maintenance and a servo-driven Automatic Tool Changer (ATC) available in 8- or 40-tool configurations. To further support unmanned operation and consistent quality, the platform can be equipped with automated tool and workpiece inspection systems.
For more information contact:
DN Solutions
360 E State Pkwy.
Schaumburg, IL 60173
312-265-7500
DNSA.Marketing@dncompany.com
www.dn-solutions.com
IMTS South Building, Level 3
Booth 338919
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