Machining/Grinding Centers Provide CMM-Level Precision
June 1, 2020
The Vertex Hybrid G 55-5X/75-5X/100-5X machines from Mitsui Seiki are engineered to provide CMM-level precision in critical high-speed milling and grinding applications, such as lights-out machining of die and mold, optical and tooling components. The machines are capable of 0.0003" (7.5 µm) or better precision in 3+2 or fully simultaneous 5-axis machining, carrying out high speed milling and grinding via a 25,000 RPM BBT40 main spindle and ATC changeable air spindles of 40,000 to 90,000 RPM capacity.
"The machines take advantage of Mitsui Seiki's engineered accuracy and rigidity to allow volumetric calibration according to ISO10320-2 using the latest FANUC 3D volumetric compensation features, and enable use of in-process 3D (NIST) traceable measuring capability," said a company spokesperson. A part spinning process produces tangential planetary work spindle alignment, emulating the U-axis motion of jig grinding equipment. The machines can employ trochoidal dynamic power or high-speed cutting strategies up to 90,000 RPM.
Key features include automatic in-process grinding wheel dressing and size measurement and wheel calibration. AE sensors and software guided application strategies monitor milling and grinding process finishes.
Vertex machines feature proprietary cast iron beds and a solid box-in-box design for enhanced rigidity, stiffness and agility. Innovative machine geometry results in positioning accuracy in the XYZ axes of 0.001 mm (0.000040"), ±6 arc seconds in A-axis and ±4 arc seconds in the C-axis.
Hand-scraped guideways maximize precision. An advanced thermal compensation system helps assure size consistency, and glass scales provide minimum resolution of 0.001 mm.
For more information contact:
Mitsui Seiki USA, Inc.
563 Commerce Street
Franklin Lakes, NJ 07417
201-337-1300
info@mitsuiseiki.com
www.mitsuiseiki.com
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