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Mobile Robotic Solution for Increased Chip Production

"With demand for semiconductor chips continuing to surge, fabricators are seeking ways to improve operational efficiency and increase output. To achieve these goals, KUKA Robotics recently highlighted a mobile robotic solution developed in partnership with the world's largest semiconductor fabricators," said a company spokesperson. "The solution reliably transfers materials in areas unsuitable for traditional automated material handling systems."

The KUKA mobile robotic wafer-handling system for human/machine collaboration provides material transport of 200 mm or 300 mm wafer boxes and SMIF boxes, open cassette machine loading and unloading.

The system combines a KUKA LBR iiwa 14 R820 CR robot mounted on one of the company's KMP 200 CR automated mobile platforms. Both the robot and mobile platform are cleanroom class ISO 3 rated and feature advanced safety and navigational functionality.

As a 7-axis robot, the LBR iiwa 14 R820 CR handles payloads up to 14 kg and has no external cabling for obstruction-free operation. The mobile platform is outfitted with KUKA's omnidirectional wheel technology for maximum flexibility and high-precision movement.

For simplicity and ease of use, the solution is completely integrated with one controller for the robot, platform and navigation as well as one software solution for all three. Safety functions include laser scanning and safety warning/safety stop fields, among others.

For more information contact:

KUKA Robotics Corporation

51870 Shelby Parkway

Shelby Township, MI 48315-1787


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