Innovations at PACK EXPO International

The Innovation Stage at PACK EXPO International (November 6–9; McCormick Place, Chicago) is shaping up to be the largest and most robust on-floor education feature since its inception in 2012, according to show producer PMMI, The Association for Packaging and Processing Technologies.

PACK EXPO International, including three stages located in the Grand Concourse, will bring together industry leaders and subject matter experts for free educational programming addressing the most top-of-mind issues and trends. Sessions will address topics including:

• Internet of Things

• Machinery safety

• Standards and technology to improve productivity

• Sustainability

• Flexible manufacturing systems

• Smart packaging

• Contract packaging

• Global packaging trends

• Digital print technology

• Multipack solutions

• Ultrasonic technology.

To date, 59 sessions are confirmed, all 30-minutes in length. All sessions are free to attend. Check the schedule for full details. The full session schedule will also be accessible through the PACK EXPO International mobile app.

“We know that our attendees have a lot to accomplish while at PACK EXPO. With that in mind, the importance of offering valuable education on the show floor is a priority,” said Charles D. Yuska, President and CEO, PMMI. “The PACK EXPO gives attendees access to a wide range of processing and packaging education and innovations.”

"PACK EXPO International will bring together exhibitors showcasing processing and packaging innovations to 50,000 attendees in over 1.2 million net square feet of exhibit space," said a spokesperson.

Registration for the show is $100 and includes admission to all exhibits and the Innovation Stage.

For more information or to register contact:

PACK EXPO International

packexpointernational.com

www.PMMI.org

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